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<br>
Hot Interconnects 15<br>
IEEE Symposium on High-Performance Interconnects<br>
August 22-24, 2007<br>
Stanford University<br>
Palo Alto, California, USA<br>
<br>
Hot Interconnects is the premier international forum for researchers and<br>
developers of state-of-the-art hardware and software architectures and<br>
implementations for interconnection networks of all scales, ranging from<br>
on-chip processor�~@~Smemory interconnects to wide-area networks. This yearly<br>
conference is very well attended by leaders in industry and academia. The<br>
atmosphere provides for a wealth of opportunities to interact with<br>
individuals at the forefront of this field.<br>
<br>
Themes include cross-cutting issues spanning computer systems, networking<br>
technologies, and communication protocols. This conference is directed<br>
particularly at new and exciting technology and product innovations in these<br>
areas. Contributions should focus on real experimental systems, prototypes,<br>
or leading-edge products and their performance evaluation. In addition to<br>
those subscribing to the main theme of the conference, contributions are<br>
also solicited in the topics listed below.<br>
<br>
* Novel and innovative interconnect architectures<br>
* Multi-core processor interconnects<br>
* System-on-Chip Interconnects<br>
* Advanced chip-to-chip communication technologies<br>
* Optical interconnects<br>
* Protocol and interfaces for interprocessor communication<br>
* Survivability and fault-tolerance of interconnects<br>
* High-speed packet processing engines and network processors<br>
* System and storage area network architectures and protocols<br>
* High-performance host-network interface architectures<br>
* High-bandwidth and low-latency I/O<br>
* Tb/s switching and routing technologies<br>
* Innovative architectures for supporting collective communication<br>
* Novel communication architectures to support grid computing<br>
<br>
Submission Guideline<br>
o Submission deadline: March 31, 2007<br>
o Notification of acceptance: May 15, 2007<br>
o Papers need sufficient technical detail to judge quality and<br>
suitability for presentation.<br>
o Submit title, author, abstract, and full paper (six pages,<br>
double-column, IEEE format).<br>
o Papers should be submitted electronically at the specified link<br>
location found on <a href="http://www.hoti.org" target="_blank" onclick="return top.js.OpenExtLink(window,event,this)">http://www.hoti.org</a><br>
o For further information please see<br>
<a href="http://www.hoti.org/hoti15/cfp.html" target="_blank" onclick="return top.js.OpenExtLink(window,event,this)">http://www.hoti.org/hoti15/cfp.html</a><br>
<br>
About the Conference<br>
- Conference held at the William Hewlett Teaching Center at<br>
Stanford University.<br>
- Papers selected will be published in proceedings by the<br>
IEEE Computer Society.<br>
- Presentations are 30-minute talks in a single-track format.<br>
- Online information at <a href="http://www.hoti.org" target="_blank" onclick="return top.js.OpenExtLink(window,event,this)">http://www.hoti.org</a><br>
<br>
GENERAL CO-CHAIRS<br>
* John W. Lockwood, Washington University in St. Louis<br>
* Fabrizio Petrini, Pacific Northwest National Laboratory<br>
<br>
TECHNICAL CO-CHAIRS<br>
* Ron Brightwell, Sandia National Laboratories<br>
* Dhabaleswar (DK) Panda, The Ohio State University<br>
<br>
LOCAL ARRANGEMENTS CHAIR<br>
* Songkrant Muneenaem, Washington University in St. Louis<br>
<br>
PANEL CHAIR<br>
* Daniel Pitt, Santa Clara University<br>
<br>
PUBLICITY CO-CHAIRS<br>
* Weikuan Yu, Oak Ridge National Laboratory<br>
<br>
PUBLICATION CHAIR<br>
* Luca Valcarenghi, Scuola Superiore Sant'Anna<br>
<br>
FINANCE CHAIR<br>
* Herzel Ashkenazi, XilinxREGISTRATION CHAIR<br>
* Songkrant Muneenaem, Washington University in St. Louis<br>
<br>
TUTORIAL CO-CHAIRS<br>
- TBA<br>
<br>
REGISTRATION CHAIR<br>
* Songkrant Muneenaem, Washington University in St. Louis<br>
<br>
Webmaster<br>
* Liz Rogers, LRD Group<br>
<br>
Steering Committee<br>
o Allen Baum, Intel<br>
o Lily Jow, Hewlett Packard<br>
o Mark Laubach, Broadband Physics<br>
o John Lockwood, Stanford University<br>
o Daniel Pitt, Santa Clara University<br>
<br>
Technical Program Committee<br>
* Dennis Abts Cray, Inc.<br>
* Adnan
Aziz
University of Texas, Austin<br>
* Alan Benner IBM<br>
* Keren Bergman Columbia University<br>
* Andrea Bianco Politecnico di Torino<br>
* Piero Castoldi Scuola Superiore Sant'Anna<br>
* Sarang Dharmapurikar Nuova Systems<br>
* Hans Eberle Sun<br>
* Wu-chun Feng Virginia Tech<br>
* Juan Fernandez University of Murcia<br>
* Ada Gavrilovska Georgia Institute of Technology<br>
* Paolo Giaccone Politecnico di Torino<br>
* Mitchell Gusat IBM Zurich Research Laboratory<br>
* Ron
Ho
Sun Microsystems Laboratories<br>
* Doan
Hoang
University of Technology, Sydney<br>
* Jayasimha Jay Intel<br>
* Isaac Keslassy Technion<br>
* Venkata Krishnan Stargen Inc.<br>
* Tal
Lavian
Nortel Networks Labs, UC Berkeley<br>
* Bill
Lin
University of California, San Diego<br>
* Olav
Lysne
Simula Research Laboratory<br>
* Pankaj Mehra HP Labs<br>
* Rami
Melhem
University of Pittsburgh<br>
* Cyriel Minkenberg IBM Zurich Research Laboratory<br>
* Gregory Pfister IBM<br>
* Craig Stunkel IBM T.J. Watson Research Center<br>
* Anujan
Varma
University of California at Santa Cruz<br>
<br>